HTS is excited to announce the implementation of the new UNDERFILL machine, the MYCRONIC MYD10i! This investment represents a significant step in the innovation of solutions for the electronics industry, as it enables us to further improve the quality and reliability…
HTS Innovations: Reflow oven with Vacuum Technology
We are excited to announce the installation of the new Reflow Oven, HELLER 1911 MKIII – VACUUM Discover the cutting-edge features of our new Reflow Oven with Vacuum Technology designed to increase efficiency, precision and performance. MAIN FEATURES: – Unparallel Precision:…
Finally here we are: Welcome to HTSLAB!
We are excited to announce the opening of our new innovative facility, HTS LAB! With HTS LAB, we have laid the foundation for a future full of innovation and growth that will exceed all expectations. We wanted to open a new…
HTS chooses Ansys SIwave: The Ultimate Solution for PCB and IC Package Simulation
If you are a designer or engineer working in the electronics field, you know how essential it is to ensure the signal and power integrity and management of electromagnetic interference (EMI) in your PCB and IC package designs. The good news…
Innovation at the heart of the project! HTS implements new equipment: the AOI 3D OMRON VT-S1080
Innovation is the beating heart of every company that aims to thrive and grow in a continuously developing sector such as EMS, and we at HIGH TECHNOLOGY SYSTEMS are no exception. Today we are pleased to announce an important step towards…