HTS is excited to announce the implementation of the new UNDERFILL machine, the MYCRONIC MYD10i!
This investment represents a significant step in the innovation of solutions for the electronics industry, as it enables us to further improve the quality and reliability of our production processes, meeting the needs of our customers by offering consistently cutting-edge service.
What is meant by UNDERFILL?
Underfill is a technological process involving the application of an adhesive material, usually resin, underneath electronic components mounted on printed circuit boards (PCBs).
The goal is to fill the space between the chip and the board, creating additional protection against mechanical stress, vibration, and thermal variations.
This treatment is especially useful for delicate components such as ball grid array ( BGA) chips, which are more susceptible to damage from thermal and physical stress.
What is the purpose of UNDERFILL?
The UNDERFILL process is essential for improving the robustness of electronic components, increasing their durability and preventing the risk of failure during use.
It protects devices from external factors, such as vibration or shock, that could affect chip operation, especially in applications wherereliability is crucial.
In addition, underfill helps distribute thermal stresses more evenly between the chip and the board, reducing the risk of malfunction caused by expansion and contraction during temperature cycles.
Who does UNDERFILL serve?
The UNDERFILL process is particularly useful for companies in theconsumer electronics, automotive, telecommunications and medical device industries.
These sectors require highly reliable solutions that can withstand extreme conditions and provide lasting performance.
The introduction of the MYCRONIC MYD10i enables us to offer higher quality and greater precision in the underfill application process, meeting the specific needs of each customer.
With the UNDERFILL machine, MYCRONIC MYD10i, HTS positions itself as a leader in offering advanced solutions for the electronics industry, aiming to support our partners in producing safer and longer-lasting devices.
Through this innovation, we are ready to meet the challenges of the global market with cutting-edge technologies and increasingly excellent service.
Take a look at our page “Technologies and Services”, discover the breadth of services offered and choose what’s right for you!
Join us in our excitement for this exciting new chapter!
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